HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 644
HD64F2218TF24
Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2218TF24
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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• Use the recommended algorithm when programming and erasing flash memory.
• Do not set or clear the SWE1 bit during execution of a program in flash memory.
Note: * Refer to section 22.7, Flash Memory Characteristics.
• Do not use interrupts while flash memory is being programmed or erased.
• Do not perform additional programming. Erase the memory before reprogramming.
• Before programming, check that the chip is correctly mounted in the PROM programmer.
• Do not touch the socket adapter or chip during programming.
• The reset state must be entered after powering on
• When a reset is applied during operation, this should be done while the SWE1 pin is low.
Note: * Refer to section 22.7, Flash Memory Characteristics.
Rev.7.00 Dec. 24, 2008 Page 588 of 698
REJ09B0074-0700
The recommended algorithm enables programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
P1 or E1 bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against
program runaway, etc.
Wait at least θ µs* after clearing the SWE1 bit before executing a program or reading data in
flash memory. When the SWE1 bit is set, data in flash memory can be rewritten, but access
flash memory only for verify operations (verification during programming/erasing). Also, do
not clear the SWE1 bit during programming, erasing, or verifying. Similarly, when using
emulation by RAM with a high level applied to the FWE pin, the SWE1 bit should be cleared
before executing a program or reading data in flash memory. However, read/write accesses can
be performed in the RAM area overlapping the flash memory space regardless of whether the
SWE1 bit is set or cleared.
All interrupt requests, including NMI, should be disabled during FWE application to give
priority to program/erase operations.
In on-board programming, perform only one programming operation on a 128-byte
programming unit block. In programmer mode, too, perform only one programming operation
on a 128-byte programming unit block. Programming should be carried out with the entire
programming unit block erased.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
Touching either of these can cause contact faults and write errors.
Apply the reset signal for at least 100 µs during the oscillation setting period.
Wait at least θ µs* after clearing the SWE1 bit before applying the reset.
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