HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 648
HD64F2218TF24
Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2218TF24
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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17.14
The masked ROM version does not have the internal registers for flash memory control that are
provided in the F-ZTAT version. Table 17.9 lists the registers that are present in the F-ZTAT
version but not in the masked ROM version. If a register listed in table 17.9 is read in the masked
ROM version, an undefined value will be returned. Therefore, if application software developed on
the F-ZTAT version is switched to a masked ROM version product, it must be modified to ensure
that the registers in table 17.9 have no effect.
Table 17.9 Registers Present in F-ZTAT Version but Absent in Masked ROM Version
Rev.7.00 Dec. 24, 2008 Page 592 of 698
REJ09B0074-0700
Register
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM emulation register
Serial control register x
Note on Switching from F-ZTAT Version to Masked ROM Version
Abbreviation
FLMCR1
FLMCR2
EBR1
EBR2
RAMER
SCRX
Address
H'FFA8
H'FFA9
H'FFAA
H'FFAB
H'FEDB
H'FDB4
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