HD64F2377RVFQ33W Renesas Electronics America, HD64F2377RVFQ33W Datasheet - Page 62
HD64F2377RVFQ33W
Manufacturer Part Number
HD64F2377RVFQ33W
Description
IC H8S MCU FLASH 384K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2377RVFQ33W
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 6.2
Table 6.3
Table 6.4
Table 6.5
Table 6.6
Table 6.7
Table 6.8
Table 6.9
Table 6.10
Table 6.11
Table 6.12
Table 6.13
Section 7 DMA Controller (DMAC)................................................................. 279
Table 7.1
Table 7.2
Table 7.3
Table 7.4
Table 7.5
Table 7.6
Table 7.7
Table 7.8
Table 7.9
Table 7.10
Table 7.11
Table 7.12
Section 8 EXDMA Controller (EXDMAC) ...................................................... 359
Table 8.1
Table 8.2
Table 8.3
Table 8.4
Section 9 Data Transfer Controller (DTC) ........................................................ 425
Table 9.1
Table 9.2
Table 9.3
Table 9.4
Table 9.5
Rev.7.00 Mar. 18, 2009 page lx of lxvi
REJ09B0109-0700
Bus Specifications for Each Area (Basic Bus Interface) ......................................... 173
Data Buses Used and Valid Strobes ........................................................................ 178
Relation between Settings of Bits RMTS2 to RMTS0 and DRAM Space.............. 191
Relation between Settings of Bits MXC2 to MXC0 and Address Multiplexing ..... 192
DRAM Interface Pins.............................................................................................. 193
Relation between Settings of Bits RMTS2 to RMTS0
and Synchronous DRAM Space.............................................................................. 216
Relation between Settings of Bits MXC2 to MXC0 and Address Multiplexing ..... 217
Synchronous DRAM Interface Pins ........................................................................ 219
Setting CAS Latency ............................................................................................... 222
Idle Cycles in Mixed Accesses to Normal Space and DRAM Continuous
Synchronous DRAM Space..................................................................................... 264
Pin States in Idle Cycle ........................................................................................... 268
Pin States in Bus Released State ............................................................................. 271
Pin Configuration .................................................................................................... 281
Short Address Mode and Full Address Mode (Channel 0)...................................... 282
DMAC Activation Sources ..................................................................................... 307
DMAC Transfer Modes........................................................................................... 310
Register Functions in Sequential Mode................................................................... 312
Register Functions in Idle Mode ............................................................................. 315
Register Functions in Repeat Mode ........................................................................ 317
Register Functions in Single Address Mode ........................................................... 320
Register Functions in Normal Mode ....................................................................... 323
Register Functions in Block Transfer Mode............................................................ 326
DMAC Channel Priority Order ............................................................................... 347
Interrupt Sources and Priority Order ....................................................................... 353
Pin Configuration .................................................................................................... 361
EXDMAC Transfer Modes ..................................................................................... 374
EXDMAC Channel Priority Order.......................................................................... 390
Interrupt Sources and Priority Order ....................................................................... 420
Relationship between Activation Sources and DTCER Clearing............................ 432
Interrupt Sources, DTC Vector Addresses, and Corresponding DTCEs ................. 435
Chain Transfer Conditions ...................................................................................... 439
Register Function in Normal Mode......................................................................... 440
Register Function in Repeat Mode .......................................................................... 441
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