HD64F3644PV Renesas Electronics America, HD64F3644PV Datasheet - Page 132

• Manufacturer Part Number: HD64F3644PV
• Description: IC H8/3644 MCU FLASH 32K 64SDIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Lr

Specifications of HD64F3644PV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-SDIP (0.750", 19.05mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 6 ROM
6.3.3
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 6.5 shows the recommended screening procedure.
If a group of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects, using a
microcomputer with on-chip EPROM in a windowed package, etc. Please inform Renesas
Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
Rev. 6.00 Sep 12, 2006 page 110 of 526
REJ09B0326-0600
Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
Reliability of Programmed Data
Figure 6.5 Recommended Screening Procedure
Bake chip for 24 to 48 hours
Read and check program
verify programmed data
Program chip and
at 125 C to 150 C
with power off
Install