HD64F2145BTE20 Renesas Electronics America, HD64F2145BTE20 Datasheet - Page 808
HD64F2145BTE20
Manufacturer Part Number
HD64F2145BTE20
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Specifications of HD64F2145BTE20
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
74
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 27 Electrical Characteristics
Item
TMR
PWM,
PWMX
SCI
A/D
converter
WDT
Note:
Rev. 3.00 Mar 21, 2006 page 752 of 788
REJ09B0300-0300
* Only peripheral modules that can be used in subclock operation
Timer
clock
pulse
width
Pulse output delay time
Input
clock
cycle
Input clock pulse width
Input clock rise time
Input clock fall time
Transmit data delay time
(clocked synchronous)
Receive data setup time
(clocked synchronous)
Receive data hold time
(clocked synchronous)
Trigger input setup time
RESO output delay time t
RESO output pulse width t
Single edge
Both edges
Asynchronous
Synchronous
t
t
t
t
t
t
t
Symbol Min
t
t
t
t
TMCWH
TMCWL
PWOD
Scyc
SCKW
SCKr
SCKf
TXD
RXS
RXH
TRGS
RESD
RESOW
1.5
2.5
—
4
6
0.4
—
—
—
100
100
50
—
132
Condition
10 MHz
A
Max
—
—
100
—
—
0.6
1.5
1.5
100
—
—
—
200
—
Min
1.5
2.5
—
4
6
0.4
—
—
—
50
50
30
—
132
Condition
16 MHz
B
Max
—
—
50
—
—
0.6
1.5
1.5
50
—
—
—
120
—
Min
1.5
2.5
—
4
6
0.4
—
—
—
50
50
30
—
132
Condition
20 MHz
C
Max Unit
—
—
50
—
—
0.6
1.5
1.5
50
—
—
—
100
—
t
ns
t
t
t
ns
ns
ns
t
cyc
cyc
Scyc
cyc
cyc
Test
Conditions
Figure 27.20
Figure 27.22
Figure 27.23
Figure 27.24
Figure 27.25
Figure 27.26
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