HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 200

MCU 3V 256K 144-QFP

HD64F2338VFC25

Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of HD64F2338VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5.3
With DRAM space, the row address and column address are multiplexed. In address multiplexing,
the size of the shift of the row address is selected with bits MXC1 and MXC0 in MCR. Table 6.5
shows the relation between the settings of MXC1 and MXC0 and the shift size.
Table 6.5
Row
address
Column
address
Rev.4.00 Sep. 07, 2007 Page 168 of 1210
REJ09B0245-0400
MXC1 MXC0
0
1
Address Multiplexing
Address Multiplexing Settings by Bits MXC1 and MXC0
MCR
0
1
0
1
Shift
Size
8 bits
9 bits
10 bits
Setting
pro-
hibited
A
to
A
A
to
A
A
to
A
A
to
A
A
to
A
23
13
23
13
23
13
23
13
23
13
A
A
A
A
A
20
12
12
12
12
A
A
A
A
A
11
19
20
11
11
A
A
A
A
A
18
19
20
10
10
A
A
A
A
A
9
17
18
19
9
A
A
A
A
A
16
17
18
8
8
Address Pins
A
A
A
A
A
15
16
17
7
7
A
A
A
A
A
6
14
15
16
6
A
A
A
A
A
13
14
15
5
5
A
A
A
A
A
4
12
13
14
4
A
A
A
A
A
11
12
13
3
3
A
A
A
A
A
10
11
12
2
2
A
A
A
A
A
1
9
10
11
1
A
A
A
A
A
8
9
10
0
0

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