HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 207

MCU 3V 256K 144-QFP

HD64F2338VFC25

Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of HD64F2338VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(Address shift size set to 9 bits)
Figure 6.19 Example of 2-CAS DRAM Connection
Chip
HWR (WE)
CS (RAS)
D
15
LCAS
to D
CAS
A
A
A
A
A
A
A
A
A
9
8
7
6
5
4
3
2
1
0
Rev.4.00 Sep. 07, 2007 Page 175 of 1210
256-kbyte × 16-bit configuration
RAS
UCAS
LCAS
WE
A
A
A
A
A
A
A
A
A
D
8
7
6
5
4
3
2
1
0
15
2-CAS type 4-Mbit DRAM
to D
9-bit column address
Row address input:
A
Column address input:
A
0
8
8
to A
to A
OE
0
0
REJ09B0245-0400

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