HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 215

• Manufacturer Part Number: HD64F2338VFC25
• Description: MCU 3V 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2338VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6.6
When burst mode is selected with the DRAM interface, the DACK output timing can be selected
with the DDS bit. When DRAM space is accessed in DMAC single address mode at the same
time, the DDS bit selects whether or not burst access is to be performed.
6.6.1
Burst access is performed by determining the address only, irrespective of the bus master. With
the DRAM interface, the DACK output goes low from the T
Figure 6.28 shows the DACK output timing for the DRAM interface when DDS = 1.
Note: n = 2 to 5
Read
Write
Figure 6.28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
DMAC Single Address Mode and DRAM Interface
When DDS = 1
A
CS
CAS (UCAS)
LCAS (LCAS)
HWR (WE)
D
HWR (WE)
D
DACK
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
T
p
Row
T
r
Rev.4.00 Sep. 07, 2007 Page 183 of 1210
c1
state.
T
c1
Column
T
c2
REJ09B0245-0400