HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 216
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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6.6.2
When DRAM space is accessed in DMAC single address mode, full access (normal access) is
always performed. With the DRAM interface, the DACK output goes low from the T
In modes other than DMAC single address mode, burst access can be used when accessing DRAM
space.
Figure 6.29 shows the DACK output timing for the DRAM interface when DDS = 0.
Rev.4.00 Sep. 07, 2007 Page 184 of 1210
REJ09B0245-0400
Note: n = 2 to 5
Read
Write
Figure 6.29 DACK Output Timing when DDS = 0 (Example of DRAM Access)
When DDS = 0
A
CS
CAS (UCAS)
LCAS (LCAS)
HWR (WE)
D
HWR (WE)
D
DACK
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
T
p
Row
T
r
T
c1
Column
T
c2
r
state.
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