HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 316
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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7.5.14
There can be no break between a DMA cycle read and a DMA cycle write. This means that a
refresh cycle, external bus release cycle, or DTC cycle is not generated between the external read
and external write in a DMA cycle.
In the case of successive read and write cycles, such as in burst transfer or block transfer, a refresh
or external bus released state may be inserted after a write cycle. Since the DTC has a lower
priority than the DMAC, the DTC does not operate until the DMAC releases the bus.
When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these
DMA cycles can be executed at the same time as refresh cycles or external bus release. However,
simultaneous operation may not be possible when a write buffer is used.
Rev.4.00 Sep. 07, 2007 Page 284 of 1210
REJ09B0245-0400
Relation Between the DMAC and External Bus Requests, Refresh Cycles, and the
DTC
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