HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 73
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 73 of 1246
- Download datasheet (7Mb)
2.6.2
Table 2.2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU
can use.
Table 2.2
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. Cannot be used in the H8S/2339 Group.
Data
transfer
Arithmetic
operations
Logic
operations
Shift
Bit manipulation
Branch
System
control
Block data transfer
Function
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Instructions and Addressing Modes
MOV
POP, PUSH
LDM, STM
MOVFPE,
MOVTPE
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
DIVXU
MULXS,
DIVXS
NEG
EXTU, EXTS
TAS
AND, OR,
XOR
NOT
Bcc, BSR
JMP, JSR
RTS
TRAPA
RTE
SLEEP
LDC
STC
ANDC,
ORC, XORC
NOP
Instruction
*2
Combinations of Instructions and Addressing Modes
*1
BWL
BWL
BWL
WL
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B
B
B
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BW
BW
WL
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B
L
B
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BWL
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B
B
BWL
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W
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Addressing Modes
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B
B
Rev.4.00 Sep. 07, 2007 Page 41 of 1210
BWL
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B
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REJ09B0245-0400
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BW
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L
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