HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 763
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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18.3
When the RAME bit is set to 1, accesses to addresses H'FFDC00 to H'FFFBFF are directed to the
on-chip RAM. When the RAME bit is cleared to 0, the off-chip address space is accessed.
Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written to
and read in byte or word units. Each type of access can be performed in one state.
Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start
at an even address.
Note: The amount of on-chip RAM differs depending on the product. Refer to section 3.5,
18.4
DTC register information can be located in addresses H'FFF800 to H'FFFBFF. When the DTC is
used, the RAME bit must not be cleared to 0.
Memory Map in Each Operating Mode, for details.
Operation
Usage Note
Rev.4.00 Sep. 07, 2007 Page 731 of 1210
REJ09B0245-0400
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