HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 816
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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19.11.7 Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
• The return code is retained until a command write for other than status read mode is
Table 19.21 AC Characteristics in Status Read Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
OE output delay time
Disable delay time
CE output delay time
WE rise time
WE fall time
Rev.4.00 Sep. 07, 2007 Page 784 of 1210
REJ09B0245-0400
when an abnormal end occurs in auto-program mode or auto-erase mode.
performed.
I/O
A
5
18
to I/O
to A
I/O
I/O
WE
OE
CE
0
7
6
0
CC
= 3.3 V ±0.3 V, V
Figure 19.26 Auto-Erase Mode Timing Waveforms
t
ces
t
f
t
ds
t
wep
H'20
Symbol
t
t
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
oe
df
ce
r
f
t
SS
t
ceh
r
t
= 0 V, T
dh
t
nxtc
a
= 25°C ±5°C
H'20
Min
20
0
0
50
50
70
—
—
—
—
—
Erase end identifi-
cation signal
Erase normal end
confirmation signal
t
ests
t
erase
t
spa
Max
—
—
—
—
—
—
150
100
150
30
30
H'00
t
nxtc
Unit
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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