HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 876
HD64F2338VFC25
Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of HD64F2338VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Rev.4.00 Sep. 07, 2007 Page 844 of 1210
REJ09B0245-0400
φ
V
FWE
MD2 to MD0
RES
SWE bit
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
CC
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
power-off by pulling the pins up or down.
*1
Figure 19.56 Power-On/Off Timing (Boot Mode)
t
OSC1
SWE set
t
MDS
t
*2
Wait time: x
MDS
*3
MDS
*3
(min) = 200 ns
Programming/
erasing
possible
Wait time: 100 μs
Min 0 μs
SWE cleared
Min 0 μs
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