R5F61668MZN50FPV Renesas Electronics America, R5F61668MZN50FPV Datasheet - Page 31

• Manufacturer Part Number: R5F61668MZN50FPV
• Description: MCU FLASH 1024K ROM 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61668MZN50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

29.3
Section 30 Electrical Characteristics ...............................................................1307
30.1
30.2
30.3
30.4
30.5
30.6
30.7
30.8
Appendix............................................................................................................1363
A.
B.
C.
D.
Index ..................................................................................................................1373
Register States in Each Operating Mode ........................................................................ 1290
Absolute Maximum Ratings ........................................................................................... 1307
DC Characteristics .......................................................................................................... 1308
AC Characteristics .......................................................................................................... 1311
30.3.1
30.3.2
30.3.3
30.3.4
30.3.5
USB Characteristics ........................................................................................................ 1357
A/D Conversion Characteristics ..................................................................................... 1359
D/A Conversion Characteristics ..................................................................................... 1359
Flash Memory Characteristics ........................................................................................ 1360
Power-On Reset Circuit and Voltage-Detection Circuit Characteristics ........................ 1361
Port States in Each Pin State........................................................................................... 1363
Product Lineup................................................................................................................ 1369
Package Dimensions ....................................................................................................... 1370
Treatment of Unused Pins............................................................................................... 1371
Clock Timing .................................................................................................. 1311
Control Signal Timing .................................................................................... 1314
Bus Timing ..................................................................................................... 1315
DMAC and EXDMAC Timing....................................................................... 1346
Timing of On-Chip Peripheral Modules ......................................................... 1350
Rev. 1.00 Jan. 29, 2010 Page xxxi of xxxii