DF2372RVFQ34V Renesas Electronics America, DF2372RVFQ34V Datasheet - Page 282
DF2372RVFQ34V
Manufacturer Part Number
DF2372RVFQ34V
Description
IC H8S/2372 MCU FLASH 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2372RVFQ34V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2372RVFQ34V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 6 Bus Controller (BSC)
When DDS = 1 or EDDS = 1: Burst access is performed by determining the address only,
irrespective of the bus master. With the DRAM interface, the DACK or EDACK output goes low
from the T
Figure 6.41 shows the DACK or EDACK output timing for the DRAM interface when DDS = 1 or
EDDS = 1.
Rev.7.00 Mar. 18, 2009 page 214 of 1136
REJ09B0109-0700
Figure 6.41 Example of DACK/EDACK Output Timing when DDS = 1 or EDDS = 1
Read
Write
Note: n = 2 to 5
c1
DACK or EDACK
state.
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
(RAST = 0, CAST = 0)
T
p
Row address
High
High
T
r
T
c1
Column address
T
c2
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