DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 735
DF2161BVTE10
Manufacturer Part Number
DF2161BVTE10
Description
MCU 3V 128K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2160BVT10V.pdf
(847 pages)
Specifications of DF2161BVTE10
Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
114
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2161BVTE10
HD64F2161BVTE10
HD64F2161BVTE10
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Register
Abbreviation
TCONRO
STR_2
TCONRS
SEDGR
Notes: 1. Can be used on the H8S/2160B and H8S/2161B.
2. When TWRE = 1 or SELSTR3 = 0 in LADR3L
3. When TWRE = 0 and SELSTR3 = 1 in LADR3L
4. All bits are reserved in the 64-kbyte flash memory version.
5. Not supported by the H8S/2148B and H8S/2145B (5-V version).
The EB11 and EB10 bits are reserved in the 128-kbyte flash memory version.
Bit 7
HOE
DBU27
TMRX/Y
VEDG
Bit 6
VOE
DBU26
ISGENE
HEDG
Bit 5
CLOE
DBU25
HOMOD1
CEDG
Bit 4
CBOE
DBU24
HOMOD0
HFEDG
Bit 3
HOINV
C/D2
VOMOD1
VFEDG
Rev. 3.00 Mar 21, 2006 page 679 of 788
Bit 2
VOINV
DBU22
VOMOD0
PREQF
Section 26 List of Registers
Bit 1
CLOINV
IBF2
CLMOD1
IHI
REJ09B0300-0300
CBOINV
OBF2
CLMOD0
IVI
Bit 0
Module
Timer
connection
XBS
Timer
connection
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