DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 98

• Manufacturer Part Number: DF2161BVTE10
• Description: MCU 3V 128K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2161BVTE10

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 10MHz
• Connectivity: Host Interface (LPC), I²C, IrDA, SCI, X-Bus
• Peripherals: PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2161BVTE10; HD64F2161BVTE10

Section 2 CPU
Table 2.3
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM *
STM *
Notes: 1. Size refers to the operand size.
Rev. 3.00 Mar 21, 2006 page 42 of 788
REJ09B0300-0300
2
2
2. ER7 is not used as the register that can be saved (STM)/restored (LDM) when using
B: Byte
W: Word
L:
STM/LDM instruction, because ER7 is the stack pointer.
Data Transfer Instructions
Longword
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Rn
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+
Pops two or more general registers from the stack.
Rn (register list)
Pushes two or more general registers onto the stack.
@–SP
Rd, Rs
Rn
Rn (register list)
(EAd)
@–SP