MC9S12XEP100MAL Freescale Semiconductor, MC9S12XEP100MAL Datasheet - Page 742

IC MCU 16BIT 1M FLASH 112-LQFP

MC9S12XEP100MAL

Manufacturer Part Number
MC9S12XEP100MAL
Description
IC MCU 16BIT 1M FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEP100MAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
64 KB
Interface Type
SPI, SSI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Operating Supply Voltage
- 0.3 V to + 6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
EVB9S12XEP100 - BOARD EVAL FOR MC9S12XEP100DEMO9S12XEP100 - BOARD DEMO FOR MC9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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0
Chapter 20 Serial Communication Interface (S12SCIV5)
20.4.1
This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow
pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer
specification defines a half-duplex infrared communication link for exchange data. The full standard
includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 Kbits/s and 115.2
Kbits/s.
The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The
SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse
for every zero bit. No pulse is transmitted for every one bit. When receiving data, the IR pulses should be
detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external
from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit
stream to be received by the SCI.The polarity of transmitted pulses and expected receive pulses can be
inverted so that a direct connection can be made to external IrDA transceiver modules that uses active low
pulses.
The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in
the infrared submodule in order to generate either 3/16, 1/16, 1/32 or 1/4 narrow pulses during
transmission. The infrared block receives two clock sources from the SCI, R16XCLK and R32XCLK,
which are configured to generate the narrow pulse width during transmission. The R16XCLK and
R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both
R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the
R16XCLK clock.
20.4.1.1
The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A
narrow pulse is transmitted for a zero bit and no pulse for a one bit. The narrow pulse is sent in the middle
of the bit with a duration of 1/32, 1/16, 3/16 or 1/4 of a bit time. A narrow high pulse is transmitted for a
zero bit when TXPOL is cleared, while a narrow low pulse is transmitted for a zero bit when TXPOL is set.
20.4.1.2
The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is
expected for each zero received and no pulse is expected for each one received. A narrow high pulse is
expected for a zero bit when RXPOL is cleared, while a narrow low pulse is expected for a zero bit when
RXPOL is set. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared
physical layer specification.
20.4.2
This module provides some basic support for the LIN protocol. At first this is a break detect circuitry
making it easier for the LIN software to distinguish a break character from an incoming data stream. As a
further addition is supports a collision detection at the bit level as well as cancelling pending transmissions.
742
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Infrared Interface Submodule
LIN Support
Infrared Transmit Encoder
Infrared Receive Decoder
MC9S12XE-Family Reference Manual , Rev. 1.23
Freescale Semiconductor

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