DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 11
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Price
Company:
Part Number:
DF2377RVFQ33
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33W
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Renesas Electronics America
Quantity:
10 000
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Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Item
8.4.2 Address Modes
Figure 8.3 Data Flow in
Single Address Mode
Figure 8.4 Example of
Timing in Single Address
Mode
Page
377
378
Revision (See Manual for Details)
Figure amended
Figure amended
Transfer from external memory to external device with DACK
Transfer from external device with DACK to external memory
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
EXDMA cycle
EXDMA cycle
EDDAR
EDSAR
Rev.7.00 Mar. 18, 2009 page ix of lxvi
External device
with DACK
External
memory
Address to external memory space
RD signal to external memory space
Data output from external memory
Address to external memory space
WR signal to external memory space
Data output from external device
with DACK
REJ09B0109-0700
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