DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 1128
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 26 Electrical Characteristics
(4) DMAC and EXDMAC Timing
Table 26.35 DMAC and EXDMAC Timing
Conditions: V
Rev.7.00 Mar. 18, 2009 page 1060 of 1136
REJ09B0109-0700
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
EDREQ setup time
EDREQ hold time
ETEND delay time
EDACK delay time 1
EDACK delay time 2
EDRAK delay time
0 V, φ = 8 MHz to 34 MHz, T
T
a
CC
= −40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
EDRQS
EDRQH
ETED
EDACD1
EDACD2
EDRKD
CC
= 3.0 V to 3.6 V, V
Min.
25
10
⎯
⎯
⎯
25
10
⎯
⎯
⎯
⎯
a
= −20°C to +75°C (regular specifications),
Max.
⎯
⎯
18
18
18
⎯
⎯
18
18
18
18
ref
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
Test Conditions
Figure 26.31
Figure 26.30
Figures 26.28 and 26.29
Figure 26.31
Figure 26.30
Figure 26.28 and 26.29
Figure 26.32
CC
, V
SS
= AV
SS
=
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