DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 964
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 21 Flash Memory (0.18-μm F-ZTAT Version)
(1)
Parts of the procedure program that are made by the user, like download request,
programming/erasing procedure, and determination of the result, must be executed in the on-chip
RAM. The on-chip program that is to be downloaded is all in the on-chip RAM. Note that area in
the on-chip RAM must be controlled so that these parts do not overlap.
Figure 21.10 shows the program area to be downloaded.
programming/erasing
Rev.7.00 Mar. 18, 2009 page 896 of 1136
REJ09B0109-0700
processing period
Unusable area in
(Size : 4 kbytes)
On-Chip RAM Address Map when Programming/Erasing Is Executed
downloaded
Area to be
Figure 21.10 RAM Map when Programming/Erasing Is Executed
Initialization + programming program
Programming/erasing program entry
Initialization + erasing program
Area that can be used by user
Area that can be used by user
Initialization program entry
+ Programming finished
Programming finished
(Return value: 1 byte)
< On-chip RAM >
System use area
(15 bytes)
DPFR
or
Address
RAMTOP (H'FF4000/H'FF6000/H'FF8000)
FTDAR setting
FTDAR setting + 16
FTDAR setting + 32
FTDAR setting + 4
RAMEND (H'FFC000)
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