DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 311
![IC H8S MCU FLASH 3V 384K 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2377RVFQ33W
Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33W
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Company:
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
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Section 6 Bus Controller (BSC)
When DDS = 0 or EDDS = 0: When continuous synchronous DRAM space is accessed in
DMAC or EXDMAC single address transfer mode, full access (normal access) is always
performed. With the synchronous DRAM interface, the DACK or EDACK output goes low from
the T
state.
r
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing continuous synchronous DRAM space.
Figure 6.61 shows the DACK or EDACK output timing for connecting the synchronous DRAM
interface when DDS = 0 or EDDS = 0.
Rev.7.00 Mar. 18, 2009 page 243 of 1136
REJ09B0109-0700
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