PIC16C66/JW Microchip Technology, PIC16C66/JW Datasheet - Page 165
![IC MCU OTP 8KX14 PWM 28CDIP](/photos/7/29/72984/150-28-cdip_sml.jpg)
PIC16C66/JW
Manufacturer Part Number
PIC16C66/JW
Description
IC MCU OTP 8KX14 PWM 28CDIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66/JW
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
EPROM, UV
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-CDIP (0.300", 7.62mm) Window
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16LC62A-04SP PDF datasheet #3
- PIC16C66-04SO PDF datasheet #4
- Current page: 165 of 337
- Download datasheet (3Mb)
16.2
DC CHARACTERISTICS
D001
D002*
D003
D004*
D010
D010A
D020
D021
D021A
Note 1: This is the limit to which V
Param
1997 Microchip Technology Inc.
No.
*
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
DC Characteristics:
Supply Voltage
RAM Data Retention Volt-
age (Note 1)
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Supply Current (Note 2)
Power-down Current
(Note 3)
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
DD
DD
start voltage to
rise rate to ensure
Characteristic
DD
; WDT enabled/disabled as specified.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
DD
DD
PIC16LC61-04 (Commercial, Industrial)
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
V
V
S
I
I
DD
PD
Sym
can be lowered without losing RAM data.
measurements in active operation mode are:
DD
DR
POR
VDD
/2Rext (mA) with Rext in kOhm.
0.05
Min
3.0
-
-
-
-
-
-
-
Typ† Max Units
V
1.5
1.4
0.6
0.6
15
5
SS
-
-
6.0
2.5
32
20
12
9
0˚C
-
-
-
-40˚C
V/ms See section on Power-on Reset for details
mA
V
V
V
A
A
A
A
T
T
See section on Power-on Reset for details
F
F
LP osc configuration
V
V
V
XT, RC, and LP osc configuration
A
A
OSC
OSC
DD
DD
DD
+85˚C for industrial and
+70˚C for commercial
= 3.0V, WDT enabled, -40 C to +85 C
= 3.0V, WDT disabled, 0 C to +70 C
= 3.0V, WDT disabled, -40 C to +85 C
= 4 MHz, V
= 32 kHz, V
DD
,
Conditions
DD
PIC16C6X
DD
= 3.0V (Note 4)
= 3.0V, WDT disabled,
DS30234D-page 165
DD
and V
SS
.
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