AT91M40800-33AI SL383 Atmel, AT91M40800-33AI SL383 Datasheet - Page 5
AT91M40800-33AI SL383
Manufacturer Part Number
AT91M40800-33AI SL383
Description
IC ARM MCU 16BIT 100TQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheets
1.AT91M40800-33AU.pdf
(18 pages)
2.AT91R40807-33AI.pdf
(153 pages)
3.AT91M40800-33AI.pdf
(21 pages)
Specifications of AT91M40800-33AI SL383
Core Processor
ARM7
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, UART/USART
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Other names
AT91M4080033AISL3
Junction Temperature
1393C–ATARM–19-Nov-04
The average chip-junction temperature T
1.
2.
Where:
•
•
•
•
•
From the first equation, the user can derive the estimated lifetime of the chip and
thereby decide if a cooling device is necessary or not. If a cooling device is to be fitted
on the chip, the second equation should be used to compute the resulting average chip-
junction temperature T
on page 4.
provided in Table 5 on page 4.
datasheet.
P
“Power Consumption” on page 3.
T
T
T
JA
JC
HEAT SINK
A
D
J
J
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in Table 5
=
= package thermal resistance, Junction-to-case thermal resistance (°C/W),
=
T
T
A
A
+
AT91M40800 Electrical Characteristics
+
= cooling device thermal resistance (°C/W), provided in the device
P
P
D
D
HEATSINK
J
JA
in °C.
+
JC
J
in °C can be obtained from the following:
5