MC68HC705C8ACFN Freescale Semiconductor, MC68HC705C8ACFN Datasheet - Page 173

• Manufacturer Part Number: MC68HC705C8ACFN
• Description: IC MCU 4MHZ 8K OTP 44-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C8ACFN

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• Ram Size: 304 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-PLCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -

13.4 Operating Temperature Range
13.5 Thermal Characteristics
MC68HC705C8A — Rev. 3
MOTOROLA
TEST
POINT
C
(SEE TABLE)
Operating temperature range
Thermal resistance
1. Voltages referenced to V
2. C = Extended temperature range (– 40 C to + 85 C)
Plastic dual in-line package (DIP)
Ceramic dual in-line package (cerdip)
Plastic leaded chip carrier (PLCC)
Quad flat pack (QFP)
Plastic shrink DIP (SDIP)
Freescale Semiconductor, Inc.
MC68HC705C8ACB
MC68HC705C8ACFB
MC68HC705C8ACFS
MC68HC705C8ACP
MC68HC705C8ACFN
MC68HC705C8ACFS
P = Plastic dual in-line package (PDIP)
B = Plastic shrink dual in-line package (SDIP)
S = Ceramic dual in-line package (cerdip)
FN = Plastic-leaded chip carrier (PLCC)
FB = Quad flat pack (QFP)
FS = Ceramic-leaded chip carrier (CLCC)
V
DD
For More Information On This Product,
Figure 13-1. Equivalent Test Load
R2
(SEE TABLE)
R1
(SEE TABLE)
Go to: www.freescale.com
Characteristic
Electrical Specifications
Rating
(1)
SS
(2)
V
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
V
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
PD7, PD5, PD0
DD
DD
= 4.5 V
= 3.0 V
Pins
Pins
3.26 k
10.91 k
Symbol
Symbol
R1
6 k
R1
T
JA
A
Operating Temperature Range
2.38 k
6.32 k
Electrical Specifications
R2
6 k
– 40 to + 85
R2
T
Value
Value
L
60
50
70
95
60
to T
50 pF
Technical Data
200 pF
H
50 pF
C
C
Unit
Unit
C/W
C
173