MC68HC705C8ACP Freescale Semiconductor, MC68HC705C8ACP Datasheet - Page 193

IC MCU 4MHZ 8K OTP 40-DIP

MC68HC705C8ACP

Manufacturer Part Number
MC68HC705C8ACP
Description
IC MCU 4MHZ 8K OTP 40-DIP
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705C8ACP

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
24
Program Memory Size
8KB (8K x 8)
Program Memory Type
OTP
Ram Size
304 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC705C8ACP
Manufacturer:
MOTOROLA
Quantity:
13
Part Number:
MC68HC705C8ACP
Manufacturer:
FREESCALE
Quantity:
1 487
Part Number:
MC68HC705C8ACPE
Manufacturer:
ON
Quantity:
1 000
14.4 40-Pin Ceramic Dual In-Line Package (Cerdip)
MC68HC705C8A — Rev. 3
MOTOROLA
SEATING
PLANE
T
40
1
Figure 14-2. MC68HC705C8AS Package Dimensions (Case #734A)
G
F
A
Freescale Semiconductor, Inc.
For More Information On This Product,
D
Go to: www.freescale.com
Mechanical Specifications
40 PL
0.25(0.010)
21
20
B
N
K
M
C
T
DATUM
PLANE
A
M
40-Pin Ceramic Dual In-Line Package (Cerdip)
M
L
J
DIM
G
M
A 2.020 2.096 51.31 53.23
B 0.500 0.610 12.70 15.94
C 0.160 0.240
D 0.015 0.022
F
K 0.125 0.160
L
N 0.020 0.050
J
Mechanical Specifications
0.050 0.065
0.008 0.012
MIN
0.100 BSC
0.600 BSC
INCHES
MAX
15°
MILLIMETERS
4.06
0.38
1.27
0.20
3.17
0.51
Technical Data
MIN
15.24 BSC
2.54 BSC
MAX
6.09
0.55
1.65
0.30
4.06
1.27
15°
193

Related parts for MC68HC705C8ACP