MC68HC705J1ACDW Freescale Semiconductor, MC68HC705J1ACDW Datasheet - Page 120

IC MCU 4MHZ 1.2K OTP 20-SOIC

MC68HC705J1ACDW

Manufacturer Part Number
MC68HC705J1ACDW
Description
IC MCU 4MHZ 1.2K OTP 20-SOIC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705J1ACDW

Core Processor
HC05
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
14
Program Memory Size
1.2KB (1.2K x 8)
Program Memory Type
OTP
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
MC68HC705J1ACDWE
Manufacturer:
INTERSIL
Quantity:
1 000
Price:
Electrical Specifications
10.6 Power Considerations
Technical Data
The average chip junction temperature, T
Where:
For most applications, P
Ignoring P
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
known T
by solving equations (1) and (2) iteratively for any value of T
Freescale Semiconductor, Inc.
T
P
P
P
JA
A
D
INT
I/O
For More Information On This Product,
= ambient temperature in C
= P
= package thermal resistance, junction to ambient in C/W
= power dissipation on input and output pins (user-determined)
A
= I
. Using this value of K, the values of P
INT
I/O
CC
Go to: www.freescale.com
, the relationship between P
= P
+ P
Electrical Specifications
V
D
I/O
CC
x (T
T
= chip internal power dissipation
P
J
D
A
= T
I/O
+ 273 C) +
=
A
< P
T
+ (P
J
INT
+ 273 C
D
K
and can be neglected.
x
JA
JA
)
x (P
D
J
, in C can be obtained from:
and T
D
D
)
D
2
(at equilibrium) for a
MC68HC705J1A — Rev. 4.0
and T
J
is approximately:
J
can be obtained
A
.
(1)
(2)
(3)

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