MC68HC705J1ACDW Freescale Semiconductor, MC68HC705J1ACDW Datasheet - Page 133

IC MCU 4MHZ 1.2K OTP 20-SOIC

MC68HC705J1ACDW

Manufacturer Part Number
MC68HC705J1ACDW
Description
IC MCU 4MHZ 1.2K OTP 20-SOIC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705J1ACDW

Core Processor
HC05
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
14
Program Memory Size
1.2KB (1.2K x 8)
Program Memory Type
OTP
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC705J1ACDW
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
MC68HC705J1ACDW
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
102
Part Number:
MC68HC705J1ACDWE
Manufacturer:
INTERSIL
Quantity:
1 000
11.5 Ceramic Dual In-Line Package (Case 732)
MC68HC705J1A — Rev. 4.0
H
20
1
SEATING
PLANE
F
D
A
Freescale Semiconductor, Inc.
G
11
10
For More Information On This Product,
B
C
K
N
Go to: www.freescale.com
Mechanical Specifications
J
L
M
Ceramic Dual In-Line Package (Case 732)
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSIONS A AND B INCLUDE MENISCUS.
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
FORMED PARALLEL.
DIM
A
B
C
D
F
G
H
K
L
M
N
J
0.940
0.260
0.150
0.015
0.055
0.020
0.008
0.125
0.010
MIN
0.100 BSC
0.300 BSC
0
INCHES
_
Mechanical Specifications
0.990
0.295
0.200
0.022
0.065
0.050
0.012
0.160
0.040
MAX
15
_
Technical Data

Related parts for MC68HC705J1ACDW