MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 1045

• Manufacturer Part Number: MPC564MZP66
• Description: IC MCU 512K FLASH 66MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP66

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

RCPU development access can be achieved either via the READI signals or the BDM signals on the MCU.
The access method is determined during READI module configuration.
and BDM signals are multiplexed for RCPU development access.
When the READI module is configured for RCPU development access, IEEE-ISTO 5001 compliant
vendor-defined messages are used for transmission of data in and out of the MCU.
24.14.1 RCPU Development Access Messaging
The following RCPU development access messages are used for handshaking between the device and the
tool — DSDI data message, DSDO data message, and BDM status message.
24.14.1.1 DSDI Message
The DSDI message is used by the tool to download information to the RCPU.
Freescale Semiconductor
USIU
Figure 24-78. RCPU Development Access Multiplexing between READI and BDM Signals
Development
Access
RCPU
On the MPC561/MPC563 the BDM signals are shared with the READI
signals. Therefore BDM access is limited to access via the Nexus
vendor-defined development support messages.
Multiplexer
Debug
MPC561/MPC563 Reference Manual, Rev. 1.2
READI
JTAG
NOTE
.
.
. .
.
.
TCK / DSCK / MCKI
TDO / DSDO / MDO0
TDI / DSDI / MDI0
Figure 24-78
shows how READI
BDM
signals
READI Module
24-77