MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 1051

• Manufacturer Part Number: MPC564MZP66
• Description: IC MCU 512K FLASH 66MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP66

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Figure 24-85
Freescale Semiconductor
Device sends
out Dev ID
msg after
negation of RSTI
MSEO
MDI
MSEI
HRESET
(Tool drives)
SRESET
(USIU drives)
RSTI
(Tool drives)
MDO
Figure 24-84. RCPU Development Access Timing Diagram — Debug Mode Entry Out-of-Reset
Tool negates
HRESET at least 16
system clocks after
receiving device
ready msg
1
Message
shows the transmission sequence of DSDI/DSDO data messages.
Dev ID
TC = 1
MSB
2
Config Msg
TCODE (6 bits)
TC = 18
DC reg. config
msg (BDM)
sent after DevID
msg received
by tool
(BDM)
DC reg
Figure 24-85. Transmission Sequence of DSDx Data Messages
1
3
Message
TC = 16
Device
Ready
LSB MSB
MPC561/MPC563 Reference Manual, Rev. 1.2
SRESET is negated by the MCU
HEADER (3 bits)
after some internal system clocks delay.
2
Message
TC = 58
BDM
ENTRY
4
BDM is set based on READI
module configuration
and BDM Entry msg is
sent out when VFLS[0:1]=11.
5
LSB MSB
DSDO msg
sent out
Message
TC = 56
DSDI msg
sent after.
BDM msg
DSDI
DATA (7 or 32 bits)
6
Message
TC = 57
DSDO
7
3
Message
TC = 56
DSDI
DSDI msg can be
sent to device after
TCODE and two
status bits in the
DSDO msg indicate
it is ready.
Message
TC = 57
DSDO
LSB
Message
TC = 58
BDM
EXIT
READI Module
24-83