MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 1222

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MPC564MZP66

Manufacturer Part Number
MPC564MZP66
Description
IC MCU 512K FLASH 66MHZ 388-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564MZP66

Core Processor
PowerPC
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Electrical Characteristics
F.4
F-6
1
2
ESD for Human Body Model (HBM)
HBM Circuit Description
ESD for Machine Model (MM)
MM Circuit Description
Number of pulses per pin
Positive pulses (MM)
Negative pulses (MM)
Positive pulses (HBM)
Negative pulses (HBM)
Interval of Pulses
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
ESD Protection
Characteristics
2
MPC561/MPC563 Reference Manual, Rev. 1.2
1
Table F-3. ESD Protection
Symbol
R1
R1
C
C
Value
2000
1500
100
200
200
0
3
3
1
1
1
Freescale Semiconductor
Units
pF
pF
S
V
V

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