MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 1310

• Manufacturer Part Number: MPC564MZP66
• Description: IC MCU 512K FLASH 66MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP66

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

66-MHz Electrical Characteristics
An estimation of the chip junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. Unfortunately, the answer is only an estimate; test cases have
demonstrated that errors of a factor of two are possible. As a result, more detailed thermal characterization
is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
where:
G-4
1
2
3
4
5
6
7
8
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per SEMI G38-87 and JESD51-2 with the board horizontal.
These values are the mean + 3 standard deviations of characterized data.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
the board thermal resistance.
Per JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board (Four layer (2s2p) board, natural convection).
Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per EIA/JESD51-2.
T
T
R
P
R
R
R
R
A
D
J
θJA
θJA
θJA
θJC
θJA
= T
= ambient temperature (°C)
= power dissipation in package
= junction to case thermal resistance (°C/W)
= package junction to ambient resistance (°C/W)
= R
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
A
+ (R
θJC
Characteristic
θJA
+ R
θCA
x P
Table G-2. Thermal Characteristics (continued)
D
)
MPC561/MPC563 Reference Manual, Rev. 1.2
J
, in °C can be obtained from the equation:
Symbol
R
R
Ψ
θJB
θJT
JT
21.2
Value
7.0
1.6
3,7
8
3,6
Freescale Semiconductor
°C/W
°C/W
°C/W
Unit