MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 310

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MPC564MZP66

Manufacturer Part Number
MPC564MZP66
Description
IC MCU 512K FLASH 66MHZ 388-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564MZP66

Core Processor
PowerPC
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Clocks and Power Control
Note that GCLK1_50, GCLK2_50, and CLKOUT can have a lower frequency than GCLK1 and GCLK2.
This is to enable the external bus operation at lower frequencies (controlled by EBDF in the SCCR).
GCLK2_50 always rises simultaneously with GCLK2. When DFNH = 0, GCLK2_50 has a 50% duty
cycle. With other values of DFNH or DFNL, the duty cycle is less than 50%. Refer to
GCLK1_50 rises simultaneously with GCLK1. When the MPC561/MPC563 is not in gear mode, the
falling edge of GCLK1_50 occurs in the middle of the high phase of GCLK2_50. EBDF determines the
division factor between GCLK1/GCLK2 and GCLK1_50/GCLK2_50.
During power-on reset, the MODCK1, MODCK2, and MODCK3 pins determine the clock source for the
PLL and the clock drivers. These pins are latched on the positive edge of PORESET. Their values must be
stable as long as this line is asserted. The configuration modes are shown in
8-8
GCLK1
GCLK2
CLKOUT
(EBDF = 00)
GCLK1_50
(EBDF = 01)
GCLK2_50
(EBDF = 01)
CLKOUT
(EBDF = 01)
T1
T2
T3
T4
GCLK1_50
(EBDF = 00)
GCLK2_50
(EBDF = 00)
MPC561/MPC563 Reference Manual, Rev. 1.2
Figure 8-4. MPC561/MPC563 Clocks
Table
8-1. MODCK1 specifies
Freescale Semiconductor
Figure
8-7.

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