MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 34

• Manufacturer Part Number: MPC564MZP66
• Description: IC MCU 512K FLASH 66MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP66

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

24.14
24.14.1
24.14.1.1
24.14.1.2
24.14.1.3
24.14.1.4
24.14.2
24.14.2.1
24.14.2.2
24.14.2.3
24.14.2.4
24.14.3
24.14.4
24.15
24.15.1
24.15.2
25.1
25.1.1
25.1.2
25.1.2.1
25.1.2.2
25.1.3
25.1.3.1
25.1.3.2
25.1.3.3
25.1.3.4
25.1.4
25.2
25.2.1
25.2.2
A.1
A.2
xxxiv
Paragraph
Number
IEEE 1149.1 Test Access Port ...................................................................................... 25-1
MPC561/MPC563 Restrictions .................................................................................. 25-32
ICDU Key Features ........................................................................................................ A-1
Class-Based Compression Model Main Principles......................................................... A-1
RCPU Development Access ...................................................................................... 24-76
Power Management ................................................................................................... 24-86
RCPU Development Access Messaging ................................................................. 24-77
RCPU Development Access Operation .................................................................. 24-79
Throughput .............................................................................................................. 24-82
Development Access Timing Diagrams ................................................................. 24-82
Functional Description ............................................................................................ 24-86
Low Power Modes .................................................................................................. 24-86
Overview ................................................................................................................... 25-2
Entering JTAG Mode ................................................................................................ 25-3
Instruction Register ................................................................................................. 25-30
HI-Z ........................................................................................................................ 25-32
Non-Scan Chain Operation ..................................................................................... 25-32
BSDL Description ................................................................................................... 25-33
DSDI Message .................................................................................................... 24-77
DSDO Message .................................................................................................. 24-78
BDM Status Message ......................................................................................... 24-78
Error Message (Invalid Message) ....................................................................... 24-79
Enabling RCPU Development Access Via READI Signals ............................... 24-80
Entering Background Debug Mode (BDM) Via READI Signals ...................... 24-80
Non-Debug Mode Access of RCPU Development Access ................................ 24-80
RCPU Development Access Flow Diagram ....................................................... 24-81
TAP Controller ..................................................................................................... 25-4
Boundary Scan Register ....................................................................................... 25-4
EXTEST ............................................................................................................. 25-31
SAMPLE/PRELOAD ......................................................................................... 25-31
BYPASS ............................................................................................................. 25-31
CLAMP ............................................................................................................... 25-32
MPC562/MPC564 Compression Features
IEEE 1149.1-Compliant Interface (JTAG)
MPC561/MPC563 Reference Manual, Rev. 1.2
Contents
Appendix A
Chapter 25
Title
Freescale Semiconductor
Number
Page