MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 37

• Manufacturer Part Number: MPC564MZP66
• Description: IC MCU 512K FLASH 66MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP66

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

D.20.1.1
D.20.1.2
D.20.1.3
D.20.1.4
D.20.1.5
D.20.1.6
D.20.2
D.20.3
D.20.3.1
D.20.3.2
D.20.3.3
F.1
F.2
F.2.1
F.2.2
F.2.3
F.3
F.3.1
F.4
F.5
F.6
F.7
F.8
F.8.1
F.8.2
F.9
F.9.1
F.9.2
F.10
F.10.1
F.11
F.12
F.13
Freescale Semiconductor
Paragraph
Number
Package ............................................................................................................................ F-2
EMI Characteristics ......................................................................................................... F-2
Thermal Characteristics ................................................................................................... F-3
ESD Protection ................................................................................................................ F-6
DC Electrical Characteristics........................................................................................... F-7
Oscillator and PLL Electrical Characteristics................................................................ F-11
Flash Electrical Characteristics...................................................................................... F-12
Power-Up/Down Sequencing......................................................................................... F-13
Issues Regarding Power Sequence ................................................................................ F-17
AC Timing ..................................................................................................................... F-18
READI Electrical Characteristics .................................................................................. F-45
RESET Timing............................................................................................................... F-47
IEEE 1149.1 Electrical Characteristics.......................................................................... F-50
Host RCPU Initialization of the SIOP Function....................................................... D-57
SIOP Function Performance ..................................................................................... D-57
Reference Documents .................................................................................................. F-2
Definitions and Acronyms ........................................................................................... F-3
EMI Testing Specifications.......................................................................................... F-3
Thermal References ..................................................................................................... F-5
Power-Up/Down Option A ........................................................................................ F-13
Power-Up/Down Option B ........................................................................................ F-15
Application of PORESET or HRESET ..................................................................... F-17
Keep-Alive RAM....................................................................................................... F-18
Debug Port Timing .................................................................................................... F-43
CHAN_CONTROL .............................................................................................. D-56
BIT_D ................................................................................................................... D-56
HALF_PERIOD ................................................................................................... D-56
BIT_COUNT ........................................................................................................ D-56
XFER_SIZE.......................................................................................................... D-56
SIOP_DATA ......................................................................................................... D-57
XFER_SIZE Greater Than 16 .............................................................................. D-58
Data Positioning.................................................................................................... D-58
Data Timing .......................................................................................................... D-58
MPC561/MPC563 Reference Manual, Rev. 1.2
Electrical Characteristics
Memory Access Timing
Contents
Appendix E
Appendix F
Title
Number
Page
xxxvii