MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 898

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MPC564MZP66

Manufacturer Part Number
MPC564MZP66
Description
IC MCU 512K FLASH 66MHZ 388-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564MZP66

Core Processor
PowerPC
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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CALRAM Operation
22.2
22.3
The MPC561/MPC563 chip internal memory map is shown in
The CALRAM module is divided into two sections.
TheMPC561/MPC563 contains one CALRAM module — a 32-Kbyte memory at address 0x3F 8000 –
0x3F FFFF as shown in
address spaces: 12 implemented and four unimplemented registers. The 12 implemented registers are: one
module configuration register (CRAMMCR), one register reserved for factory test, eight region base
address (CRAM_RBAx) registers, one overlay configuration register (CRAMOVLCR), and one
ownership trace register (CALRAM_OTR) to support a separate module called READI. Refer to
Chapter 24, “READI
22-2
Control section:
— Includes all the registers in the CALRAM module
Array sub-region:
— Contains memory arrays
CALRAM Block Diagram
CALRAM Memory Map
RPCU
FP
+
JTAG
Module.”
Figure 22-1
32-Kbytes CALRAM
4-Kbyte Overlay
28-Kbyte SRAM
(Non Overlay)
BBC
L-Bus
MPC561/MPC563 Reference Manual, Rev. 1.2
Figure 22-1. System Block Diagram
and
Figure
22-2. In addition, the module is assigned 16 32-bit register
READI
Flash
Interface
L2U
U-BUS
Figure
Interface
UIMB
22-2.
USIU
Freescale Semiconductor
E-Bus

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