MC68HC711E9VFN2 Freescale Semiconductor, MC68HC711E9VFN2 Datasheet - Page 182

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MC68HC711E9VFN2

Manufacturer Part Number
MC68HC711E9VFN2
Description
IC MCU 12K OTP 2MHZ 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheets

Specifications of MC68HC711E9VFN2

Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC711E9VFN2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68HC711E9VFN2
Quantity:
23
Part Number:
MC68HC711E9VFN2
Quantity:
8
Ordering Information and Mechanical Specifications
11.5 52-Pin Plastic-Leaded Chip Carrier (Case 778)
182
–L–
C
0.010 (0.25)
52
K1
Z
K
G
VIEW S
S
G1
T
L–M
–N–
1
F
H
S
N
S
0.007 (0.18)
M68HC11E Family Data Sheet, Rev. 5.1
VIEW S
0.007 (0.18)
A
V
R
–M–
J
Y
E
W
BRK
0.007 (0.18)
0.007 (0.18)
M
M
–T–
T
T
0.004 (0.100)
L–M
D
D
L–M
SEATING
PLANE
M
M
S
S
T
T
N
N
L–M
L–M
S
S
S
S
N
N
B
Z
S
S
VIEW D–D
X
U
0.007 (0.18)
NOTES:
0.007 (0.18)
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
AT DATUM –T–, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
M
G1
T
0.785
0.785
0.165
0.090
0.013
0.026
0.020
0.025
0.750
0.750
0.042
0.042
0.042
0.710
0.040
MIN
0.010 (0.25)
–––
0.050 BSC
L–M
2
INCHES
M
0.795
0.795
0.180
0.019
0.032
0.756
0.756
0.048
0.048
0.056
0.020
0.730
0.110
T
MAX
S
–––
–––
10
–––
L–M
N
Freescale Semiconductor
S
19.94
19.94
19.05
19.05
18.04
S
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
S
–––
1.27 BSC
2
T
N
L–M
MAX
20.19
20.19
19.20
19.20
18.54
S
4.57
0.48
0.81
1.21
1.21
1.42
0.50
2.79
–––
–––
10
–––
S
N
S

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