HD64F2319EVTE25 Renesas Electronics America, HD64F2319EVTE25 Datasheet - Page 388
HD64F2319EVTE25
Manufacturer Part Number
HD64F2319EVTE25
Description
IC H8S MCU FLASH 512K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2319EVTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
71
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Company:
Part Number:
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Quantity:
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Section 9 16-Bit Timer Pulse Unit (TPU)
• When TGR is an input capture register
Rev.7.00 Feb. 14, 2007 page 354 of 1108
REJ09B0089-0700
H'0F07
H'09FB
H'0532
H'0000
TIOCA
TGRA
TGRC
Figure 9.20 shows an operation example in which TGRA has been designated as an input
capture register, and buffer operation has been designated for TGRA and TGRC.
Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling
edges have been selected as the TIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in TGRA upon occurrence of
input capture A, the value previously stored in TGRA is simultaneously transferred to TGRC.
TCNT value
Figure 9.20 Example of Buffer Operation (2)
H'0532
H'0F07
H'0532
H'09FB
H'0F07
Time
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