HD64F2378RVFQ33 Renesas Electronics America, HD64F2378RVFQ33 Datasheet - Page 986
HD64F2378RVFQ33
Manufacturer Part Number
HD64F2378RVFQ33
Description
IC H8S MCU FLASH 512K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of HD64F2378RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 21 Flash Memory (0.18-μm F-ZTAT Version)
Table 21.8 (4)
Rev.7.00 Mar. 18, 2009 page 918 of 1136
REJ09B0109-0700
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Operation for Settings
of Erasure Parameter
Item
Useable Area for Erasure in User Boot Mode
On-chip
RAM
Storable/Executable Area
Boot
User
MAT
×
×
×
×
×
×
(Expanded
External
Space
Mode)
×
×
×
User
MAT
Selected MAT
Boot
User
MAT
Storage Area
Embedded
Program
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