DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 103
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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2.9.3
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits
wide, depending on the particular internal I/O register being accessed. Figure 2.16 shows the
access timing for the on-chip supporting modules. Figure 2.17 shows the pin states.
φ
Internal address bus
Read
access
Write
access
On-Chip Supporting Module Access Timing
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Figure 2.16 On-Chip Supporting Module Access Cycle
T
1
Rev.7.00 Feb. 14, 2007 page 69 of 1108
Bus cycle
Address
Write data
Read data
T
2
REJ09B0089-0700
Section 2 CPU
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