DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 211
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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6.7
6.7.1
The chip can release the external bus in response to a bus request from an external device. In the
external bus released state, the internal bus master continues to operate as long as there is no
external access.
If an internal bus master wants to make an external access in the external bus released state, it can
issue a bus request off-chip.
6.7.2
In external expansion mode, the bus can be released to an external device by setting the BRLE bit
in BCRL to 1. Driving the BREQ pin low issues an external bus request to the chip. When the
BREQ pin is sampled, at the prescribed timing the BACK pin is driven low, and the address bus,
data bus, and bus control signals are placed in the high-impedance state, establishing the external
bus released state.
In the external bus released state, an internal bus master can perform accesses using the internal
bus. When an internal bus master wants to make an external access, it temporarily defers
activation of the bus cycle, and waits for the bus request from the external bus master to be
dropped.
If the BREQOE bit in BCRL is set to 1, when an internal bus master wants to make an external
access in the external bus released state, the BREQO pin is driven low and a request can be made
off-chip to drop the bus request.
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is
as follows:
Bus Release
Overview
Operation
(High) External bus release > Internal bus master external access (Low)
Rev.7.00 Feb. 14, 2007 page 177 of 1108
Section 6 Bus Controller
REJ09B0089-0700
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