DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 40
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 1 Overview
Item
Product lineup
Rev.7.00 Feb. 14, 2007 page 6 of 1108
REJ09B0089-0700
Specification
Operating power supply voltage
Operating frequency
Model
O: Products in the current lineup
Note: * The on-chip debug function can be used with the E10A emulator
(E10A compatible version). However, some function modules and pin
functions are unavailable when the on-chip debug function is in use.
Refer to figure 1.4 and figure 1.5. (The SCI channel 1 is unavailable
when the on-chip debug function is in use. Also, since the WDT
continues to operate during break status, a reset is generated when
an overflow occurs if a setting is made to reset the chip internally.)
HD64F2319
HD64F2319E *
HD64F2319C
HD6432319
HD64F2318
HD6432318
HD64F2317
HD6432317S
HD6432316S
HD64F2315
HD6432315
HD64F2314
HD6432314
HD6412312S
Condition A
2.7 to 3.6 V
2 to 20 MHz
—
—
—
O
—
O
—
O
O
—
O
—
O
O
Condition B
3.0 to 3.6 V
2 to 25 MHz
O
O
O
O
O
O
O
O
O
O
O
O
O
O
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