DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 603
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Notes: 1. Note that in modes 6, 7, 14, and 15, the on-chip ROM that can be used after a reset is
2. Note that in the mode 10 and mode 11 boot modes, the on-chip ROM that can be used
3. Apart from the fact that flash memory can be erased and programmed, operation is the
4. Apart from the fact that flash memory can be erased and programmed, operation is the
5. The capacity of on-chip ROM in the H8S/2318 F-ZTAT is 256 kbytes.
the 64-kbyte area from H'000000 to H'00FFFF.
immediately after all flash memory is erased by the boot program is the 64-kbyte area
from H'000000 to H'00FFFF.
same as in advanced expanded mode with on-chip ROM enabled.
same as in advanced single-chip mode.
The capacity of on-chip ROM in the H8S/2317 F-ZTAT is 128 kbytes.
The capacity of on-chip ROM in the H8S/2315 F-ZTAT and H8S/2314 F-ZTAT is
384 kbytes.
Rev.7.00 Feb. 14, 2007 page 569 of 1108
REJ09B0089-0700
Section 17 ROM
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