DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 725
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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17.22.5 Flash MAT Configuration
This LSI's flash memory is configured by the 512-kbyte user MAT and 8-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes if it is in ROM valid mode. However,
the user boot MAT can be programmed only in boot mode and PROM mode.
The user MAT and user boot MAT have different memory sizes. Do not access a user boot MAT
that is 8 kbytes or more. When a user boot MAT exceeding 8 kbytes is read from, an undefined
value is read.
Address H'000000
Address H'07FFFF
Figure 17.62 Flash Memory Configuration
<User MAT>
512 kbytes
Address H'001FFF
Address H'000000
Rev.7.00 Feb. 14, 2007 page 691 of 1108
<User boot MAT>
REJ09B0089-0700
Section 17 ROM
8 kbytes
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