HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 242
HD64F3029XBL25V
Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.HD64F3029X25.pdf
(1012 pages)
Specifications of HD64F3029XBL25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Bit 3—Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND)
requested when the DTE bit is cleared to 0.
Bit 3
DTIE
0
1
Bits 2 and 1—Data Transfer Select 2A and 1A (DTS2A, DTS1A): A channel operates in full
address mode when DTS2A and DTS1A are both set to 1.
Bit 0—Data Transfer Select 0A (DTS0A): Selects normal mode or block transfer mode.
Bit 0
DTS0A
0
1
Operations in these modes are described in sections 7.4.5, Normal Mode, and 7.4.6, Block
Transfer Mode.
Description
The DEND interrupt requested by DTE is disabled
The DEND interrupt requested by DTE is enabled
Description
Normal mode
Block transfer mode
Rev. 2.0, 06/04, page 213 of 980
(Initial value)
(Initial value)
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