AD8661ARZ Analog Devices Inc, AD8661ARZ Datasheet - Page 7

• Manufacturer Part Number: AD8661ARZ
• Description: IC OPAMP GP R-R CMOS 4MHZ 8SOIC
• Manufacturer: Analog Devices Inc
• Series: DigiTrim®r

Specifications of AD8661ARZ

• Slew Rate: 3.5 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 4MHz
• Current - Input Bias: 0.3pA
• Voltage - Input Offset: 50µV
• Current - Supply: 1.25mA
• Current - Output / Channel: 140mA
• Voltage - Supply, Single/dual (±): 5 V ~ 16 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: Low Noise
• No. Of Amplifiers: 1
• Bandwidth: 4MHz
• Supply Voltage Range: 5V To 16V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
R-8, RM-8, R-14, and RU-14
CP-8-2
Rating
18 V
−0.1 V to V
18 V
Indefinite
−60°C to +150°C
−40°C to +125°C
−40°C to +85°C
−65°C to +150°C
300°C
S
Rev. D | Page 7 of 16
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
8-Lead SOIC_N
8-Lead LFCSP_VD
8-Lead MSOP
14-Lead SOIC_N
14-Lead TSSOP
1
Exposed pad soldered to application board.
JA
is specified for the worst-case conditions, that is, a device
AD8661/AD8662/AD8664
θ
121
75
142
88.2
114
JA
1
θ
43
18
44
56.3
23.3
JC
1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W