LX8213-00ISE Microsemi Analog Mixed Signal Group, LX8213-00ISE Datasheet - Page 10

• Manufacturer Part Number: LX8213-00ISE
• Description: IC REG LDO 300MA ADJ SOT23-5
• Manufacturer: Microsemi Analog Mixed Signal Group

Specifications of LX8213-00ISE

• Regulator Topology: Positive Adjustable
• Voltage - Output: 1.2 ~ 5.5 V
• Voltage - Input: 2.5 ~ 6 V
• Voltage - Dropout (typical): 0.17V @ 300mA
• Number Of Regulators: 1
• Current - Output: 300mA (Min)
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -
• Other names: LX8213-00ISETR

Copyright © 2009
Rev. 1.1, 2009-03-24
regulators in a small 5 pin SOT-23 package that provides a
compact and cost effective solution. The LX8213 is offered with
fixed output voltages of 1.2V or 3.3V, in addition to an adjustable
version with an output voltage range of 1.2V to 5.5V.
LX8213 features low power consumption over a wide supply
voltage range, high output voltage accuracy, low dropout,
excellent line and load regulation, fast transient response, and low
noise. Please refer to the Electrical Characteristics Table for the
specifications.
Description
Input Capacitor
To improve load transient response and noise rejection, an
input bypass capacitor is recommended, but it is not required
for stability. There are no requirements for the ESR
(Equivalent Series Resistor) on the input capacitor, but
tolerance and temperature coefficient must be considered
when selecting the capacitor to ensure the capacitor will be
around 1µF over the entire operating temperature range.
Capacitors with X5R or X7R characteristics are recommended.
Output Capacitor
For stability of the regulator, use a minimum 1uF capacitor to
bypass from VOUT to GND. Note that the LX8213 is stable
using low ESR ceramic capacitors. Capacitors with X5R or
X7R
recommended.
Adjustable Output Voltage
The LX8213-00 output voltage can be set within the range of
1.2V to 5.5V by connecting the FB pin to an external resistor
divider (See Figure 3). The output voltage can be calculated
using:
R2 is chosen to minimize the power dissipated by the resistor
divider network while providing enough FB input bias current.
A value of 8.06kΩ is recommended.
Shutdown (
The LX8213 includes an active low shutdown input (
When the
resistor to GND of 3MΩ will automatically disable the device.
Upon shutdown, an internal MOSFET connected from VOUT
to GND will be turned ON to discharge the output capacitor.
To enable the regulator, set
capability is not required, connect
specification on minimum and maximum logic high levels,
please refer to the Electrical Characteristics Table.
V
The LX8213 is a family of CMOS based LDO (Low Drop-Out)
OUT
characteristics
=
0.8
TM
SHDN
⎡
⎢ ⎣
SHDN
1
+
R1
R2
pin is left floating, an internal pull down
)
⎤
⎥ ⎦
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
generally
SHDN
perform
to logic high. If shutdown
SHDN
A P P L I C A T I O N I N F O R M A T I O N
pin to VIN.
well
Analog Mixed Signal Group
and
Microsemi
SHDN
®
The
are
For
).
The LX8213 uses a foldback current limit. When the load current
exceeds approximately 400mA, the output voltage is reduced
along with the output current, minimizing power dissipated and
protecting the device from excessive heating.
Short Circuit Current Protection
Under conditions where the output of the LX8213 is shorted to
ground, internal circuitry will limit the device to source only about
50mA.
The thermal protection shuts down the LX8213 when the junction
temperature exceeds approximately 165°C, with a hysteresis of
about 30˚C.
Thermal shutdown protects the integrated circuit from thermal
overload caused from a rise in junction temperature during power
dissipation. This means the protection is intended for fault
protection only and not as a means of current or power limiting
during normal application usage. Proper thermal evaluation
should be done to ensure that the junction temperature dose not
exceed it’s maximum rating. Operating at the maximum T
150°C can impact reliability. Due to variation in individual device
electrical characteristics and thermal resistance, the built in
thermal overload protection may be activated at power levels
slightly above or below the rated dissipation.
Power dissipation for regulator can be calculated using the
following equation:
P
(Note: power dissipation resulting from quiescent current is
negligible)
For the SOT23 package, thermal resistance, θ
when mounted on a FR4 copper clad PCB. Junction temperature
of the integrated circuit can be calculated using:
T
An example: Given conditions: T
I
Total Power dissipation P
Junction Temperature
Foldback Current Limit
Temperature Protection
Thermal Consideration
Calculated values:
OUT
D
J
= T
= (V
300mA Low Noise CMOS LDO Regulator
= 200mA.
PRODUCTION DATASHEET
A
IN(MAX)
+ T
RISE
-V
, substituting: T
OUT(MIN)
) * I
OUT(MAX)
T
J
D(total)
= 25°C +(0.26W *250°C/W) = 90°C
A
+ (P
A
= (2.5-1.2) V * 0.2A =0.26W
= 25°C, V
D
* θ
JA
).
IN
= 2.5V, V
JA
is 250°C/W
LX8213
OUT
= 1.2V,
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