LM2937ES-3.3/NOPB National Semiconductor, LM2937ES-3.3/NOPB Datasheet - Page 9

IC REGULATOR LDO TO-263

LM2937ES-3.3/NOPB

Manufacturer Part Number
LM2937ES-3.3/NOPB
Description
IC REGULATOR LDO TO-263
Manufacturer
National Semiconductor
Datasheet

Specifications of LM2937ES-3.3/NOPB

Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 26V
Voltage - Dropout (typical)
0.11V @ 50mA
Number Of Regulators
1
Current - Output
500mA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (3 leads + Tab), TO-263AA
Number Of Outputs
1
Polarity
Positive
Input Voltage Max
26 V
Output Voltage
3.3 V
Output Type
Fixed
Output Current
0.5 A
Line Regulation
9.9 mV
Load Regulation
3.3 mV
Voltage Regulation Accuracy
+/- 5 %
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
 Details
Other names
*LM2937ES-3.3
*LM2937ES-3.3/NOPB
LM2937ES-3.3

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM2937ES-3.3/NOPB
Quantity:
10 781
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Manufacturer:
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Quantity:
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Manufacturer:
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Application Hints
When a value for θ
a heatsink must be selected that has a value that is less than
or equal to this number.
θ
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the package to the plane.
Figure 3 shows for the TO-263 the measured values of θ
for different copper area sizes using a typical PCB with 1
ounce copper and no solder mask over the copper area used
for heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32˚C/W.
As a design aid, Figure 4 shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming θ
mum junction temperature is 125˚C).
(H−A)
FIGURE 4. Maximum Power Dissipation vs T
FIGURE 3. θ
is specified numerically by the heatsink manufacturer
(J−A)
the TO-263 Package
(H−A)
TO-263 Package
vs Copper (1 ounce) Area for the
is found using the equation shown,
(J−A)
(Continued)
is 35˚C/W and the maxi-
(J−A)
10011320
10011321
for the TO-263
AMB
for
(J−A)
9
Figure 5 and Figure 6 show the information for the SOT-223
package. Figure 6 assumes a θ
copper and 51˚C/W for 2 ounce copper and a maximum
junction temperature of +85˚C.
Please see AN1028 for power enhancement techniques to
be used with the SOT-223 package.
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave sol-
dering to attach the small SOT-223 package to a printed
circuit board. The excessive temperatures involved may
cause package cracking.
Either vapor phase or infrared reflow techniques are pre-
ferred soldering attachment methods for the SOT-223 pack-
age.
FIGURE 6. Maximum Power Dissipation vs T
FIGURE 5. θ
(J−A)
the SOT-223 Package
SOT-223 Package
vs Copper (2 ounce) Area for the
(J−A)
of 74˚C/W for 1 ounce
10011322
10011323
www.national.com
AMB
for