USBULC6-2F3 STMicroelectronics, USBULC6-2F3 Datasheet - Page 6

• Manufacturer Part Number: USBULC6-2F3
• Description: IC ESD PROTECTION ASD 4FLIPCHIP
• Manufacturer: STMicroelectronics

Specifications of USBULC6-2F3

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Power (watts): 60W
• Polarization: 2 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: 4-FlipChip
• Applications: USB
• Number Of Circuits: 2
• Voltage - Working: 6V
• Technology: Diode Array
• Mounting Style: SMD/SMT
• Diode Type: Low Capacitance
• Power Dissipation Pd: 60W
• Diode Case Style: Flip Chip
• No. Of Pins: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-8166-2; USBULC6-2F3

Ordering information scheme
3
4
6/9
Ordering information scheme
Figure 16. Ordering information scheme
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 17. Package dimensions
260 µm
USB protection
Ultra Low Capacitance
Breakdown voltage
6 = 6 V
Number of lines
2 = 2 lines
Package
F = Flip Chip
3 = L
ead-free, pitch = 400 µm, bump = 255 µm
0.92 mm ± 30 µm
MIN
400 µm ± 40
255 µm ± 40
USB ULC 6 - 2 F3
605 µm ± 55
USBULC6-2F3
®